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Joined 1 year ago
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Cake day: June 12th, 2023

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  • In this case does packaging mean packaging the silicon die to a processor or soc that can then be used? Or does it mean the assembly of the end product, such as a phone or laptop?

    In either case it seems like a moot point to complain that this is a major issue for the long term. Shouldn’t assembly lines for said stuff should be much easier to build in comparison to a chip fab?

    Also the fact that the Arizona fab only produces a small fraction of TSMC’s total output is kind of obvious. There are a lot of chip fabs, so US encouragement for domestic production has to be an ongoing effort.





  • Obviously that has to be reflected in the price of the product. Presumably even more so with storage.

    Also there might be a use case, where cost is paramount and the drive would experience very limited writes.

    I’ve got a personal anecdote that’s not entirely the same, but I’ve bought a bunch of flash chips from china to use with retro games. Those are often salvaged, but they are also cheap and available to buy. It doesn’t matter if the chips can’t take too many write cycles, if you only flash them a couple of times.


  • Should the delays and subsequent costs overruns then be simply attributed to increased regulatory complexity or corporate greed?

    I’m looking at the list of reactors in France, most of the builds during the last millennium were completed in more or less 10 years. Then there was a gap, and the new one is taking way longer than previous ones.

    Same thing has happened in many other countries. Including finland, where at first we got 4 reactors in 6-10 years, and then after a gap of 25 years the next reactor was a clusterfuck that took almost 20years to build.

    Both of these reactors are of the same design, and the issues are at least partially attributed to the company having forgot how to manage such large projects due to the years long gap in construction.